Samsung Galaxy S9 Said to Use Next-Gen Substrate Like PCB Technology: Report
Published on July 22, 2017 in Technology • Source:

Key Takeaways from this article

Reports suggest that Samsung will be using SLP (Substrate Like PCB) motherboard on the smartphone to make room for a bigger battery than its predecessor models.
SLP is essentially a next-generation board with semiconductor package technology
SLP will also help in making the smartphone more efficient in terms of battery usage and it will also have a big impact on the weight and size of the phone.